EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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Product Description: E 1172 A is the latest innovative capillary stream Emerson & Cuming's underfill. E 1172 A is a fast-flowing, fast-curing underfill. It is a component that acidifies the epoxy resin to enhance moisture resistance. This combination of innovative properties of the sealant makes it one of today's commercially available capillary underfill. Unlike similar products, E 1172 A is the highest part of the reliability of the high load matched low CTE solder. While E 1172 A in the low cure temperature (135 ° C), working abnormally long life resulted in a very consistent distribution of multiple production shifts
Application: E 1172 A is formulated for very fine pitch area array equipment, 25 is easily filled with filling equipment for micron geometry. It provides a uniform, free sealant layer that maximizes the temperature cycling capability of the array device through its special adhesion with all common stresses by separating the stress away from the solder distribution on the surface
產(chǎn)品描述：E 1172 A是Emerson＆Cuming*新創(chuàng)新的毛細(xì)管流化床底蓋。 E 1172 A是一種快速流動(dòng)，快速固化的底部填充物。它是使環(huán)氧樹(shù)脂酸化以增強(qiáng)耐濕性的成分。這種密封劑的創(chuàng)新性能的組合使其成為當(dāng)今商業(yè)可用的毛細(xì)管底層填料之一。與同類(lèi)產(chǎn)品不同，E 1172A是高負(fù)載匹配低CTE焊料的可靠性的*高部分。雖然E 1172 A在低固化溫度（135°C）下，工作異常長(zhǎng)壽命導(dǎo)致多個(gè)生產(chǎn)班次的非 |
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