ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/ECCOBOND G500HF電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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樂泰 ABLESTIK G 500HF is a general purpose epoxy adhesiveand sealant that cures to a high gloss finish.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Density, g/cm3 1.45
Sag Resistance, mils 600 to 900
Press Flow, seconds 30 to 60
Shelf Life @ 25°C, months 3
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
60 minutes @ 125°C or
20 minutes @ 150°C or
5 minutes @ 175°C
For optimum performance, follow the initial cure with a post cure of 2 to4 hours at the highest expected use temperature.The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
StorageStore product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 25°C. Storage greater than or below 25°C can adversely affect product properties. 樂泰 ABLESTIK G 500HF是一種通用環(huán)氧膠粘劑和密封劑，固化成高光澤度。
固化材料的典型特性
密度，g / cm 3 1.45
流掛電阻，密耳600至900
按流，秒30至60
保質(zhì)期@ 25°C，月3
閃點 - 見SDS
典型的固化性能
治愈時間表
在125°C或60分鐘
在150°C或20分鐘
175分鐘5分鐘
為了獲得*佳性能，請用2次后固化的初始固化在*高預(yù)期使用溫度下4小時。以上治療方案是指導(dǎo)性建議。治愈條件（時間和溫度）可能會根據(jù)客戶的經(jīng)驗及其應(yīng)用要求，以及客戶固化設(shè)備，烤箱加載和實際烤箱溫 |
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