HYSOL KL-5100HT電子膠水/塑封膠水/漢高樂(lè)泰膠水/塑封方案
技術(shù)服務(wù)熱線:021-51693135 / 021-22818476
Product ℃ HYSOL KL-5100HT Description High thermal conductivity molding material designed to improve the thermal transmission properties of semiconductor devices.
Recommended for isolated power transistors requiring high thermal transmission properties 2 W / mK N / A MSL N / A linear flow, cm 38 hot plate gel time, second 35 filled content% 83 CTEa1, ppM / ℃ 20 Tg, 160 Main features High thermal conductivity;
Excellent formability; Excellent electrical properties
產(chǎn)品℃HYSOL KL-5100HT描述 高導(dǎo)熱塑封料,設(shè)計(jì)用于改善半導(dǎo)體器件熱 傳播屬性。
推薦用于需要高熱傳播屬性的隔 離功率晶體管 導(dǎo)熱率2 W/mK N/A MSL N/A 線性流 動(dòng),厘米 38熱板凝膠 時(shí)間,秒35 填充含 量 % 83 CTEa1, ppM/℃ 20 Tg,160
主要特點(diǎn) 高導(dǎo)熱性;優(yōu)良的成形性;優(yōu)異的電性能 |